![]() H05K3/32- Assembling printed circuits with electric components, e.g.H05K3/30- Assembling printed circuits with electric components, e.g.H05K3/00- Apparatus or processes for manufacturing printed circuits.H05K- PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS.H05- ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR. ![]() ASSIGNMENT OF SECURITY INTEREST IN PATENT COLLATERAL Assignors: BARCLAYS BANK PLC Status Abandoned legal-status Critical Current Links (F/K/A ALPHA METALS, INC.) Assigned to CITIBANK, N.A. Assignors: KOEP, PAUL J., TORMEY, ELLEN S., SIDONE, GIRARD Publication of US20180020554A1 publication Critical patent/US20180020554A1/en Assigned to BARCLAYS BANK PLC, AS COLLATERAL AGENT reassignment BARCLAYS BANK PLC, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). reassignment ALPHA ASSEMBLY SOLUTIONS INC. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from US201261613233P external-priority Application filed by Alpha Assembly Solutions Inc filed Critical Alpha Assembly Solutions Inc Priority to US15/716,963 priority Critical patent/US20180020554A1/en Assigned to ALPHA ASSEMBLY SOLUTIONS INC. Original Assignee Alpha Assembly Solutions Inc Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Tormey Girard Sidone Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Abandoned Application number US15/716,963 Inventor Paul Joseph Koep Ellen S. Google Patents US20180020554A1 - Solder Preforms and Solder Alloy Assembly Methods US20180020554A1 - Solder Preforms and Solder Alloy Assembly Methods
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